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AssigneeSemitool, Inc.
InventorsSteven L. Peace, Gary Curtis, Raymon Thompson, Brian Aegerter, Curt Dundas
Estimating the term…
An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.
A method for processing a workpiece comprising the steps of:
A metallization process used to form a microelectronic component and/or interconnect structures on a semiconductor wafer, comprising the steps of:
A method for removing an oxide from a first side and from an outer margin of a second side of a workpiece through selective contact with an oxide etchant, comprising the steps of:
A method for removing metal from a workpiece, comprising the steps of:
A process for removing metal contamination from a semiconductor wafer having a first side, and edge and a second side, and with a barrier layer on the wafer and a thin film or seed layer over at least a portion of the barrier layer, and a metal layer over at least a portion of the thin film layer, comprising:
Dependencies are inferred from the claim text.