Back to results
US 2005/0032333 A1Published application
Wafer thinning using magnetic mirror plasma
AssigneeiFire Technologies, Inc.
InventorsTerry Turner, James Spain, Richard Banks
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
AssigneeiFire Technologies, Inc.
InventorsTerry Turner, James Spain, Richard Banks
Estimating the term…
A method for manufacturing integrated circuits uses an atmospheric magnetic mirror plasma etching apparatus to thin a semiconductor wafer. In addition the process may, while thinning, both segregate and expose through-die vias for an integrated circuit chip. To segregate, the wafer may be partially diced. Then, the wafer may be tape laminated. Next, the backside of the wafer may be etched. As the backside material is removed, the partial dicing and through-die vias may be exposed. As such, the method reduced handling steps and increases yield. Furthermore, the method may be used in association with wafer level processing and flip chip with bump manufacturing.
A method for segregating an integrated circuitry chip from a wafer, the method comprising:
A system for segregating an integrated circuitry chip from a wafer, the system comprising:
A method for segregating an integrated circuitry chip from a wafer and exposing at least one integrated circuitry feature, the at least one integrated circuitry feature having a depth extending from a front side of the wafer, the method comprising:
Dependencies are inferred from the claim text.