Shielded semiconductor chip carrier having a high-density external interface
AssigneeAries Electronics, Inc.
InventorWilliam Sinclair
Life of this patent
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Abstract
A shielded semiconductor chip carrier having a high-density external interface includes conventional printed circuit boards having plated through holes for achieving shielding of the contacts of the matrix. Two fork type connectors have molded about the distal ends thereof an annular ring of dielectric plastic material, and fork type connectors are press fit into each plated through hole, thereby locking the electrical contact within the shield formed by the plated through hole. The resulting connector provides a high-density contact matrix with each connector being electrically shielded along substantially its entire length.
Claims10
A shielded semiconductor chip carrier, comprising:
- a housing for holding a semiconductor die;
- a semiconductor die housed within said housing;
- said housing including a conductive substrate having a plurality of parallel, plated-through holes therein;
- a corresponding plurality of elongated, electrically conductive first blade contacts, each first blade contact having a dielectric bead material disposed about an intermediate portion thereof, each said first blade contact being press fit into a plated-through hole so that the first blade contact is electrically isolated from said substrate, each said first blade contact having an external portion outside of said substrate and an internal portion within the interior of said substrate, said external portion being electrically connected to said semiconductor die;
- and
- a socket including a second conductive substrate having a plurality of parallel, plated-through holes therein, a corresponding plurality of elongated, electrically conductive second blade contacts, each said second blade contact having a dielectric bead material disposed about an intermediate portion thereof, each said second blade contact being press fit into a plated-through hole of said second conductive substrate so that each said second blade contact is electrically isolated from said second conductive substrate, each of said second blade contacts having an external portion outside of said second conductive substrate for connection to a connector component, and an internal portion within the interior of said second conductive substrate for connection to the corresponding internal portion of said first blade contact, said housing and socket being interconnected such that the semiconductor die is electrically connected to the connector component by shielded electrical connections.
Dependencies are inferred from the claim text.