Rotating gripper wafer flipper
AssigneeMicron Technology, Inc.
InventorsWillard Hofer, Shawn Davis, Joe Phillips
Life of this patent
Estimating the term…
Abstract
A method for inspecting semiconductor wafers. Specifically, an arm which is constructed to hold a wafer, is mounted on a rotational device to provide a user with the means of inspecting a wafer in any position without having to physically touch the wafer or move the wafer to another inspection station. The arm provides rotation about an axis parallel to the surface of the wafer, as well as rotation about an axis run which is perpendicular to the surface of the wafer and extends through the axial center of the wafer.
Claims23
A method of inspecting a semiconductor wafer, comprising the acts of:
- (a) loading a substrate into a holding structure, the substrate having a first surface and a second surface;
- (b) inspecting the first surface of the substrate by rotating the substrate within the holding structure about a first axis, the first axis disposed generally perpendicular to the surface of the substrate and extending generally through the axial center of the substrate;
- (c) rotating the holding structure about a rotatable member to rotate the substrate approximately 180° about a second axis, the rotatable member being mechanically coupled to the holding structure;
- (d) inspecting the second surface of the substrate;
- and
- (e) removing the substrate from the holding structure.
A method of inspecting a semiconductor wafer, comprising the acts of:
- placing a substrate into a holding structure, the substrate having a first surface and a second surface;
- inspecting the first surface of the substrate by rotating the substrate within the holding structure about a first axis;
- and
- inspecting the second surface of the substrate by rotating the holding structure about a second axis different than the first axis.
A method of inspecting a semiconductor wafer, comprising the acts of:
- inserting a substrate into a holding structure, the substrate having a first surface and a second surface;
- rotating the substrate within the holding structure about a first axis to inspect the first surface, the first axis generally perpendicular to the surface of the substrate and extending generally through the axial center of the substrate;
- and
- flipping the holding structure approximately 180° about a second axis to inspect the second surface, the second axis generally parallel to the surface of the substrate.
Dependencies are inferred from the claim text.