Semiconductor device and manufacturing method of the same

Abstract

The invention provides a semiconductor package and a manufacturing method thereof where reliability improves. The method has preparing a semiconductor wafer having a plurality of devices to be sealed (a semiconductor integrated circuit, a CCD, and so on) and a glass substrate for supporting the semiconductor wafer and sealing the devices to be sealed, coating room temperature curable resin on either a surface of the semiconductor wafer facing to the glass substrate or a surface of the glass substrate facing to the semiconductor wafer, attaching the semiconductor wafer and the glass substrate with the room temperature curable resin disposed therebetween at room temperature, and dividing the semiconductor wafer into individual semiconductor packages by cutting it along a scribe line.

Dependencies are inferred from the claim text.