Back to results
US 2005/0029634 A1Published application
Topless semiconductor package
AssigneeInternational Rectifier Corporation
InventorJohn Ambrus
Life of this patent
Estimating the term…
Abstract
A semiconductor package which includes a die pad that is exposed through the top surface of its molded housing.
Claims21
A semiconductor package comprising:
- a semiconductor die, said semiconductor die including a first power electrode disposed on a first surface thereof, and a second power electrode disposed on a second opposing surface thereof;
- a die pad and a plurality of leads, said die pad including a first surface and a second surface opposite to said first surface of said die pad, said second surface being electrically and mechanically connected to said second power electrode of said semiconductor die, and said leads including terminal ends adapted for mounting onto a substrate;
- a molded housing, said molded housing including a first exterior surface and a second exterior surface opposite said first exterior surface, said first exterior surface being arranged to be closer to said substrate than said second exterior surface;
- wherein at least said first surface of said die pad is exposed through said second exterior surface of said molded housing.
1 more element
A semiconductor package comprising:
- a power MOSFET, said power MOSFET including a drain electrode on one surface thereof, a source electrode and a gate electrode on another opposing surface thereof;
- a lead frame including a die pad and a plurality of leads, said die pad being electrically and mechanically connected to said drain electrode and electrically connected to at least some of said plurality of leads, said source electrode being electrically connected to at least some of said leads and said gate electrode electrically connected to at least one of said leads, and said leads being adapted for surface mounting onto a substrate;
- a molded housing, said molded housing including a first exterior surface and a second exterior surface, said first exterior surface being arranged closer to said substrate than said second exterior surface;
- wherein said die pad is exposed through said second exterior surface.
1 more element
A semiconductor package comprising:
- a semiconductor die;
- a die pad and a plurality of leads, said die pad including a first surface and a second surface opposite to said first surface of said die pad, said second surface being thermally connected to said semiconductor die, and said leads including terminal ends adapted for mounting onto a substrate;
- a molded housing, said molded housing including a first exterior surface and a second exterior surface opposite said first exterior surface, said first exterior surface being arranged to be closer to said substrate than said second exterior surface;
- wherein at least said first surface of said die pad is exposed through said second exterior surface of said molded housing.
1 more element
Dependencies are inferred from the claim text.