Atomic layer deposited Zr-Sn-Ti-O films using TiI4
AssigneeMicron Technology, Inc.
InventorsKie Ahn, Leonard Forbes
Life of this patent
Estimating the term…
Loading patent…
AssigneeMicron Technology, Inc.
InventorsKie Ahn, Leonard Forbes
Estimating the term…
A dielectric film containing Zr—Sn—Ti—O formed by atomic layer deposition using a TiI4 precursor and a method of fabricating such a dielectric film produce a reliable dielectric layer having an equivalent oxide thickness thinner than attainable using SiO2. Depositing titanium and oxygen onto a substrate surface by atomic layer deposition using a TiI4 precursor, depositing zirconium and oxygen onto a substrate surface by atomic layer deposition, and depositing tin and oxygen onto a substrate surface by atomic layer deposition form the Zr—Sn—Ti—O dielectric layer. Dielectric films containing Zr—Sn—Ti—O formed by atomic layer deposition using TiI4 are thermodynamically stable such that the Zr—Sn—Ti—O will have minimal reactions with a silicon substrate or other structures during processing.
An electronic device comprising:
A capacitor, comprising:
The capacitor of claim 11, wherein the dielectric layer exhibits a dielectric constant in the range from about 50 to about 70.
The capacitor of claim 11, wherein the Zr—Sn—Ti—O layer includes an amorphous Ti-rich Zr—Sn—Ti—O film.
A transistor comprising:
A transistor comprising:
A memory comprising:
An electronic system comprising:
An electronic system comprising:
Dependencies are inferred from the claim text.