Wire bonders and methods of wire-bonding

A method of wire-bonding, comprising:

• providing a wire severing tool having a first electrode and a second electrode spaced apart from at least a portion of the first electrode to define an opening;
• positioning a wire in the opening between the first and second electrodes;
• and
• generating an electrical discharge between the first and second electrodes to sever the wire.

A wire bonder for bonding a wire to a terminal of a microelectronic component, the wire bonder comprising:

• a bond head having a capillary;
• a first electrode and a second electrode each coupled to the bond head;
• and
• a controller operably coupled to the first and second electrodes to selectively generate an electrical discharge between the first and second electrodes to sever the wire.

A wire bonder for bonding a wire to a terminal of an electronic component, the wire bonder comprising:

• a bond head having a capillary;
• a first electrode and a second electrode disposed relative to the bond head;
• and
• a controller operably coupled to the first and second electrodes, the controller having a computer-readable medium containing instructions to perform a method comprising—
• positioning the first electrode and a second electrode at least proximate to the wire attached to the terminal of the electronic component;
• and
• severing the wire with an electrical discharge between the first and second electrodes.

A wire bonder for bonding a wire to a terminal of a microelectronic component, the wire bonder comprising:

• a bond head having a capillary;
• a first electrode and a second electrode disposed relative to the bond head;
• and
• a controller operably coupled to the first and second electrodes, the controller having a computer-readable medium containing instructions to perform a method comprising—
• attaching the wire to the terminal of the microelectronic component;
• and
• generating an arc between the first and second electrodes to sever the wire at a point at least proximate to the first and second electrodes.