Surface mounted electronic circuit module

Abstract

A electronic circuit module of the present invention comprises a circuit board 1 formed with laminated plurality of insulating sheets, and a cover 9 made from a metal plate and having attaching legs 9c soldered to electrode portions 7 in the concave portions 1c in a state of covering the electronic component 8. The concave portions 1c are formed from an upper surface of the circuit board 1 toward a lower surface side, stopping portions 1d for plugging the lower portions of the concave portions 1c are provided in the circuit board 1, and the attaching legs 9c of the cover 9 are soldered to the electrode portions 7 in a state of being inserted into the concave portions 1c. As a result, it is possible to prevent the soldering connecting the attaching legs 9c to the electrode portions 7 from leaking downward by way of the stopping portions 1d.

Dependencies are inferred from the claim text.