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AssigneeSony Chemicals Corp.
InventorsHideyuki Kurita, Masanao Watanabe, Masayuki Nakamura, Mitsuhiro Fukuda, Hiroyuki Usui
Estimating the term…
The present invention pertains to a multilayer flexible wiring board. The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer, wherein the resin film is adapted to form an opening when the bump to force into the resin film and an ultrasonic wave is applied to the bump and the bump is left in the opening to electrically connect the top of the bump to the first wiring layer.
A process for manufacturing a multilayer flexible wiring board by using a first single-wiring layer board piece having a first patterned wiring layer and a first resin film in close contact with said first wiring layer and a second single-wiring layer board piece having a second patterned wiring layer and a plurality of bumps connected to said second wiring layer at the bottoms to laminate said first and second single-wiring layer board pieces into a multilayer flexible wiring board, said process comprising bringing the top of each of said bumps into contact with said first resin film, applying ultrasonic wave to at least one of said first and second single-wiring layer board pieces to force into said first resin film in contact with said each bump to form an opening, and bringing said each bump into contact with said first wiring layer to electrically connect said first and second wiring layers via said each bump.
A process for manufacturing a multilayer flexible wiring board by using a first single-wiring layer board piece having a first patterned wiring layer and a first resin film in close contact with said first wiring layer, and a second single-wiring layer board piece having a second patterned wiring layer and a plurality of bumps connected to said second wiring layer at the bottoms, to laminate said first and second single-wiring layer board pieces into a multilayer flexible wiring board, said process comprising bringing a projection on an ultrasonic manufacturing apparatus into contact with said first resin film, applying ultrasonic wave to said projection to force into said first resin film to form an opening, and then bringing the top of each of said bumps of said second single-wiring layer board piece into contact with said first wiring layer at the bottom of said opening.
Dependencies are inferred from the claim text.