Semiconductor test unit having low contact resistance with examined electronic products, semiconductor contact board, method for testing semiconductor device, semiconductor device, and method for manufacturing thereof

A semiconductor test unit comprising:

• a test circuit for inputting/outputting a test signal to/from an examined electronic product;
• a test signal wiring electrically connected to the test circuit;
• a contact board electrically connected to an electrode of the examined electronic product and provided with a conductive via to which the test signal is transmitted, the contact board being made of an insulative porous material with air permeability and having top and bottom faces;
• a multilayer circuit board electrically connected to the conductive via and the test signal wiring, located below the bottom face of the contact board, and made of an insulative air-permeable material;
• and
• a vacuum attachment mechanism for attaching the examined electronic product, the contact board, and the multilayer circuit board thereto by vacuum, thereby holding the same.

A semiconductor test unit comprising:

• a test circuit for inputting/outputting a test signal to/from an examined electronic product;
• a test signal wiring electrically connected to the test circuit;
• a contact board electrically connected to an electrode of the examined electronic product and provided with a conductive via to which the test signal is transmitted, the contact board being made of an insulative, porous, and air-permeable material and having top and bottom faces;
• a wiring circuit electrically connected to the test signal wiring and the conductive via and provided in a state where the wiring circuit is attached to at least any one of the top and bottom faces of the contact board;
• and
• a vacuum attachment mechanism for attaching the examined electronic product and the contact board thereto by vacuum, thereby holding the same.

A semiconductor testing method comprising:

• preparing a contact board made of an insulative, porous, and air-permeable material, the contact board having a conductive via formed by any one of plating and filling with a metal in the insulative, porous, and air-permeable material;
• preparing an examined electronic product having any one of an electrode terminal, a solder bump, and a gold bump formed on an electrode thereof;
• connecting the conductive via of the contact board and any one of the electrode terminal, the solder bump, and the gold bump of the examined electronic product;
• and
• supplying a test signal to the examined electronic product to conduct a test.

A semiconductor production method comprising:

• preparing a contact board having a base plate made of an insulative, porous, and air-permeable material, and having a conductive via formed by any one of plating and filling a metal in the porous material;
• mounting an electronic product on the contact board such that any one of an electrode terminal, a solder bump, and a gold bump of the electronic product is contacted with the conductive via of the contact board;
• connecting the conductive via of the contact board and any one of the electrode terminal, the solder bump, and the gold bump of the electronic product;
• supplying a test signal to the electronic product to conduct a test;
• and
• finishing the step of supplying the test signal to the electronic product to provide a semiconductor device.

A semiconductor production method comprising:

• forming any one of an electrode terminal, a solder bump, and a gold bump on a surface of an electronic product;
• preparing a contact board having a base plate made of an insulative, porous, and air-permeable material and having a conductive via formed by any one of plating and filling a metal in the porous material of the base plate;
• mounting the electronic product on the contact board such that any one of the electrode terminal, the solder bump, and the gold bump of the electronic product is contacted with the electrically conductive via of the contact board;
• connecting the conductive via of the contact board and any one of the electrode terminal, the solder bump, and the gold bump of the electronic product;
• filling resin having arbitrary thermal expansion coefficient and elastic modulus in the contact board;
• supplying a test signal to the electronic product to conduct a test;
• and
• finishing the step of supplying the test signal to the electronic product to provide a semiconductor device.