Loading patent…
AssigneesNippon Kagaku Yakin Co., Ltd., Osaka Municipal Government
InventorsKiyotaka Matsukawa, Kozo Ishihara, Tsuneo Kamiyahata, Yoshikazu Inada, Yasuyuki Agari, Masayuki Shimada
Estimating the term…
A resin composition having high thermal conductivity and excellent moldability and a method of producing the same is provided. The composition includes 40 vol % or more of a matrix resin, 10 to 55 vol % of a thermally conductive filler dispersed in the matrix resin and the balance of a low-melting point alloy connecting the thermally conductive filler to each other and having a melting point not higher than 500° C. The proportion of the volume ratio of the low-melting point alloy to that of the thermally conductive filler is set in a range from 1/30 to 3/1.
A resin composition having high thermal conductivity comprising 40 vol % or more of a matrix resin, 10 to 55 vol % of a thermally conductive filler dispersed in the matrix resin and the balance of a low-melting point alloy connecting the thermally conductive filler to each other and having a melting point not higher than 500° c, wherein the proportion of the volume ratio of the low-melting point alloy to that of the thermally conductive filler is in a range from 1/30 to 3/1.
A method of producing a resin composition having high thermal conductivity, comprising heating a powder mixture including a matrix resin, a thermally conductive filler and a low-melting point alloy having a melting point not higher than 500° C. so as to bring the low-melting point alloy into semi-molten state in which a solid phase and liquid phase coexist, kneading the mixture in a condition which the matrix resin is completely melted, and molding the mixture into a desired shape.
A optical pickup base formed from a resin composition, said resin composition comprising 40 vol % or more of a matrix resin, 10 to 55 vol % of a thermally conductive filler dispersed in the matrix resin and the balance of a low-melting point alloy connecting the thermally conductive filler to each other and having a melting point not higher than 500° C., the proportion of the volume ratio of the low-melting point alloy to that of the thermally conductive filler being in a range from 1/30 to 3/1.
A casing for a fan motor formed from a resin composition, said resin composition comprising 40 vol % or more of a matrix resin, 10 to 55 vol % of a thermally conductive filler dispersed in the matrix resin and the balance of a low-melting point alloy connecting the thermally conductive filler to each other and having a melting point not higher than 500° C., the proportion of the volume ratio of the low-melting point alloy to that of the thermally conductive filler being in a range from 1/30 to 3/1.
Dependencies are inferred from the claim text.