Measuring apparatus
AssigneeEbara Corporation
InventorsMitsuo Tada, Yasunari Suto
Life of this patent
Estimating the term…
Abstract
A measuring apparatus includes a heating unit for applying heat to a first point within a workpiece or on a surface of a workpiece and propagating the heat to a second point within the workpiece or on the surface of the workpiece. The measuring apparatus further includes a measuring unit for measuring a displacement of the surface of the workpiece at the second point to which the heat has been propagated, and an analyzing unit for analyzing a structure of the workpiece based on the displacement measured by the measuring unit in consideration of a distance between the first point and the second point.
Claims22
A measuring apparatus comprising:
- a heating unit for applying heat to a first point in selected one of layers formed in a workpiece and propagating the heat to a second point of the workpiece;
- a measuring unit for measuring a displacement of the workpiece at the second point to which the heat has been propagated;
- and
- an analyzing unit for analyzing an internal structure of the workpiece based on the displacement measured by said measuring unit in consideration of a distance between the first point and the second point.
A measuring apparatus comprising:
- a strain applying unit for applying a strain to a first point in selected one of layers formed in a workpiece and propagating the strain to a second point of the workpiece;
- a measuring unit for measuring a displacement of the workpiece at the second point to which the strain has been propagated;
- and
- an analyzing unit for analyzing an internal structure of the workpiece based on the displacement measured by said measuring unit in consideration of a distance between the first point and the second point.
A polishing apparatus comprising:
- a polishing table having a polishing surface;
- a top ring for holding and pressing a workpiece to be polished against said polishing surface;
- and
- a measuring apparatus for measuring the thickness of layers formed in the workpiece, said measuring apparatus comprising:
- a heating unit for applying heat to a first point in selected one of the layers formed in the workpiece and propagating the heat to a second point of the workpiece;
- a measuring unit for measuring a displacement of the workpiece at the second point to which the heat has been propagated;
- and
- an analyzing unit for analyzing an internal structure of the workpiece based on the displacement measured by said measuring unit in consideration of a distance between the first point and the second point.
A polishing apparatus comprising:
- a polishing table having a polishing surface;
- a top ring for holding and pressing a workpiece to be polished against said polishing surface;
- and
- a measuring apparatus for measuring the thickness of layers formed in the workpiece, said measuring apparatus comprising:
- a strain applying unit for applying a strain to a first point in selected one of the layers formed in the workpiece and propagating the strain to a second point of the workpiece;
- a measuring unit for measuring a displacement of the workpiece at the second point to which the strain has been propagated;
- and
- an analyzing unit for analyzing an internal structure of the workpiece based on the displacement measured by said measuring unit in consideration of a distance between the first point and the second point.
Dependencies are inferred from the claim text.