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US 2004/0201964 A1Published application
Snap-in heat sink for semiconductor mounting
OwnerDennis R. Sigl, Richard Mark Achtnerinventors
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OwnerDennis R. Sigl, Richard Mark Achtnerinventors
Estimating the term…
A snap-in heat sink assembly that has an injection molded one piece frame having a plurality of spring members extending outwardly with protrusions at the free ends thereof. The assembly has a spring located against the frame and an electronic component is located atop of the spring. A heat sink has lateral surfaces with elongated grooves formed along those lateral surfaces. The sink is affixed to the frame by a simple step of inserting the heat sink into the space between the spring members such that the protrusions of the spring members snap into the grooves when the heat sink is in the desired location. By sandwiching the spring between the frame and the electronic component, the spring creates a bias to force the electronic component against the heat sink to assure good conductivity of heat from the electronic component through the heat sink.
An extruded heat sink for use in cooling an electronic component, said heat sink having a body with a flat generally planar surface and two laterally facing exterior surfaces, a plurality of thin fins extending outwardly from said body and being elongated in the direction along said two lateral exterior surfaces, each of said lateral surfaces having elongated ridges formed thereabout extending the full length of said lateral exterior surfaces.
A heat sink comprising:
A heat sink comprising:
A heat sink assembly comprising:
Dependencies are inferred from the claim text.