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AssigneeInfineon Technologies AG
InventorsManfred Proll, Gerrit Farber
Estimating the term…
A test apparatus for testing integrated modules has a plurality of connection locations on a carrier substrate. An integrated module may be connected, via a connection location, to a test unit connected to the carrier substrate. The connection locations are arranged in groups within a connection array. A control terminal via which an integrated module may be selected for a test can be provided for each connection location. An address and command terminal can be provided for each connection location. The modules of the number of groups, which are simultaneously operated, are connected to the address and command bus via the respective switching means or switch. The test frequency can thus be increased without adversely affecting the driver load.
A test apparatus for testing integrated modules, comprising a carrier substrate, the carrier substrate having a plurality of connection locations are arranged thereon, the connection locations being designed such that an integrated module is connected to a test unit connected to the carrier substrate via a connection location, the connection locations forming a connection array, the connection locations being arranged in groups within the connection array;
A method for operating a test apparatus, the test apparatus including at least some connection locations on the carrier substrate being connected to integrated modules to be tested, the method comprising:
A test apparatus for testing integrated modules, comprising a carrier substrate, the carrier substrate having a plurality of connection locations are arranged thereon, the connection locations being designed such that an integrated module is connected to a test unit connected to the carrier substrate via a connection location, the connection locations forming a connection array, the connection locations being arranged in groups within the connection array;
A method for operating a test apparatus, the test apparatus including at least some connection locations on the carrier substrate being connected to integrated modules to be tested, the method comprising:
Dependencies are inferred from the claim text.