Thermal type infrared detector and infrared focal plane array

A method for manufacturing a thermal infrared detector comprising:

• forming a temperature sensor on a substrate, said temperature sensor having electrical characteristics changing in accordance with a change in temperature;
• forming a first sacrificial layer covering said temperature sensor and partially contacting said substrate;
• removing a portion of said first sacrificial layer to expose a portion of said temperature sensor;
• forming a wiring layer on said first sacrificial layer, said wiring layer being electrically connected to said temperature sensor at a portion not covered by said first sacrificial layer;
• forming a second sacrificial layer covering said wiring layer and contacting part of said first sacrificial layer;
• forming via holes by removing a part of said first and second sacrificial layers;
• forming an infrared absorbing layer on said second sacrificial layer so that said infrared absorbing layer contacts said temperature sensor through said via holes either directly or with an insulating layer interposed;
• removing said second sacrifice layer, said first sacrifice layer, and a portion of said substrate opposite said temperature sensor.

A method for manufacturing a thermal infrared detector comprising:

• forming a first sacrificial layer on a substrate;
• forming a temperature sensor on said first sacrificial layer, said temperature sensor having electrical characteristics that change in accordance with changes in temperature on a substrate;
• forming a second sacrificial layer covering said temperature sensor and partially contacting said first sacrificial layer;
• removing a portion of said second sacrificial layer to expose a portion of said temperature sensor;
• forming a wiring layer on said second sacrificial layer electrically connected to said temperature sensor at a portion not covered by said second sacrificial layer;
• forming a third sacrificial layer covering said wiring layer and contacting part of said second sacrifice layer;
• forming via holes by removing a part of said third and second sacrificial layers;
• forming an infrared absorbing layer on said third sacrificial layer and contacting said temperature sensor through said via holes either directly or with an insulating layer interposed;
• removing said third sacrificial layer, said second sacrificial layer, and said first sacrificial layer.