Angular spin, rinse, and dry module and methods for making and implementing the same
AssigneeLam Research Corporation
InventorRandolph E. Treur
Life of this patent
Estimating the term…
Abstract
A method for processing a wafer in a spin, rinse, and dry (SRD) module is provided. The method includes engaging a wafer in a process plane, spinning the wafer in the process plane, and cleaning a top surface and a bottom surface of the wafer while spinning the wafer in the process plane. The process plane is configured to define a process angle with a horizontal plane. The process angle is configured to optimize the performance of the SRD module.
Claims16
A method for processing a substrate in a spin, rinse, and dry (SRD) module, the method comprising:
- providing the substrate to be processed;
- positioning the SRD module in a substrate receive position;
- orienting the substrate to be processed at an insert position that is defined at an angle;
- inserting the substrate into the SRD module at the angle;
- placing the SRD module in a process position;
- spinning the substrate at the angle;
- rinsing the substrate being spun at the angle;
- and
- drying the substrate being spun at the angle.
A method for processing a wafer in a spin, rinse, and dry (SRD) module, the method comprising:
- engaging a wafer in a process plane, the process plane configured to define a process angle with a horizontal plane, the process angle being configured to optimize the performance of the SRD module;
- spinning the wafer in the process plane;
- and
- cleaning a top surface and a bottom surface of the wafer while spinning the wafer in the process plane.
A method for processing a wafer in a spin, rinse, and dry (SRD) module, the method comprising:
- engaging a wafer in a process plane, the process plane configured to define a process angle with a horizontal plane, the process angle being configured to optimize the performance of the SRD module;
- spinning the wafer in the process plane;
- and
- cleaning a top surface and a bottom surface of the wafer while spinning the wafer in the process plane, the cleaning includes,
- rinsing the top surface and the bottom surface of the wafer with DI water while spinning the wafer in the process plane;
- and
- applying a megasonic flow to the top surface and the bottom surface of the wafer while spinning the wafer in the process plane.
A method for processing a wafer in a spin, rinse, and dry (SRD) module, the method comprising:
- engaging a wafer in a process plane, the process plane configured to define a process angle with the horizontal plane, the process angle being configured to optimize a drying of the wafer;
- spinning the wafer in the process plane;
- cleaning a top surface and a bottom surface of the wafer while spinning the wafer in the process plane;
- and
- drying the top surface and the bottom surface of the wafer while spinning the wafer in the process plane.
Dependencies are inferred from the claim text.