Ultra-miniature accelerometers

A method of fabricating a sensor, the method comprising:

• a) depositing an accelerometer layer above a base layer;
• b) defining a frame, a proof mass and a flexure in said accelerometer layer, said proof mass being within said frame and said flexure connecting said proof mass to said frame;
• c) defining a piezoresistive element in said flexure;
• d) depositing a silicon encapsulation layer above said frame, said proof mass and said flexure;
• e) releasing said flexure and said proof mass from said base layer and from said encapsulation layer to provide a micromachined accelerometer, said releasing performed after said depositing a silicon encapsulation layer;
• f) packaging said micromachined accelerometer within a sensor head package;
• and
• g) positioning circuitry remotely from said sensor head package, wherein said circuitry is electrically connected to said piezoresistive element.