Remote plasma enhanced cleaning apparatus

A remote plasma enhanced cleaning apparatus comprising:

• a main process chamber;
• a loadlock chamber connected to the main process chamber, wherein the main process chamber comprises a staging device adjacent to loadlock chamber for loading silicon wafers from the loadlock chamber into the main process chamber and for unloading the silicon wafers from the main process chamber into the loadlock chamber,
• a carrier robot disposed in a center of the main process chamber, wherein the carrier robot rotates and moves around the center of the main process chamber, and
• an adsorption assembly disposed adjacent to the carrier robot in the main process chamber, wherein the adsorption assembly allows native oxide films on the silicon wafers to react with active gas species to form reaction films including a mixture of Si, N, H, and F, and wherein the active gas species are formed by transforming a N2 gas, a H2 gas, and a NF3 gas into plasma;
• an anneal assembly disposed adjacent to the adsorption chamber and the carrier robot in the main process chamber, wherein the anneal assembly heats and sublimates the reaction films on the silicon wafers, and
• a cooling assembly disposed adjacent to the anneal assembly and the carrier robot in the main process chamber, wherein the cooling assembly cools the heated silicon wafers, wherein the carrier robot transfers the silicon wafers to and from the adsorption assembly, the annealing assembly, the cooling assembly and the staging device.