Cooling element for high temperature devices
AssigneesKabushiki Kaisha Toshiba, Toshiba Tec Kabushiki Kaisha
InventorTakahiro Kojima
Life of this patent
Estimating the term…
Abstract
A cooling element for cooling an electronic device in an apparatus includes a cover portion configured to cover the device, the cover portion having a top surface. A plurality of fins are positioned on the top surface of the cover portion. Each of the plurality of cooling fins are substantially parallel to each other, and each of the plurality of cooling fins has a middle portion wider than each end portion.
Claims39
A cooling element for cooling an electronic device in an apparatus, comprising:
- a cover portion configured to cover at least a portion of the device, the cover portion having a top surface;
- a plurality of cooling fins positioned on the top surface of the cover portion, each of the plurality of cooling fins being substantially parallel to each other, and
- wherein each of the plurality of cooling fins has a middle portion wider than each end portion.
An image forming apparatus, comprising:
- a scanner portion that scans and reads an image on a document;
- a printer portion that forms a copied image of the scanned image from the scanner portion, one of the scanner portion and the printer portion having a device for cooling;
- and
- a cooling element having a cover portion configured to cover the device, the cover portion having a top surface, and a plurality of cooling fins positioned on the top surface of the cover portion, each of the plurality of cooling fins being substantially parallel to each other, and
- wherein each of the plurality of cooling fins has a middle portion wider than each end portion.
A cooling element for cooling an electronic device in an apparatus, comprising:
- a cover portion configured to cover at least a portion of the device, the cover portion having a top surface;
- a plurality of cooling fins positioned on the top surface of the cover portion, each of the plurality of cooling fins being substantially parallel to each other, and
- wherein a width of a middle portion of each of the plurality of cooling fins varies from a width of each end portion of each of the plurality of cooling fins.
A cooling element for cooling an electronic device in an apparatus, comprising:
- a cover portion configured to cover at least a portion of the device, the cover portion having a top surface;
- a plurality of cooling fins positioned on the top surface of the cover portion, each of the plurality of cooling fins being substantially parallel to each other, and
- wherein each of the plurality of cooling fins has a non-uniform cross-sectional width.
Dependencies are inferred from the claim text.