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US 2004/0174677 A1Published application
CPU and electronic chipset cooler
AssigneeTing-Fei Wang
InventorShyy-Woei Chang
Life of this patent
Estimating the term…
Abstract
Disclosed is an electronic chipset or CPU cooler. The cooler comprises a rectangular heat sink including four side legs securely snapped together with the chipset or CPU for forming a space between an underside of the heat sink and a top of the chipset or CPU and a plurality of apertures arranged in a form of rows and columns. A path of jets set up by the activated fan is from the fan to the top of the chipset or CPU via the apertures and the space. The invention has several configurations.
Claims5
A cooling device for a chipset comprising:
- a fan;
- a rectangular heat sink including four side legs securely snapped together with the chipset for forming a space between an underside of the heat sink and a top of the chipset and a plurality of apertures arranged in a form of rows and columns;
- and
- a guide member coupled between the fan and a top of the heat sink, the guide member comprising a side opening in communication with the fan and a plurality of holes each abutted on a top of a corresponding one of the apertures to be in fluid communication therewith;
- wherein a path of jets set up by the activated fan is from the fan to the top of the chipset via the opening, the holes, the apertures, and the space.
2 more elements
A cooling device for a chipset comprising:
- a fan;
- and
- a rectangular heat sink including four side legs securely snapped together with the chipset for forming a space between an underside of the heat sink and a top of the chipset and a plurality of apertures arranged in a form of rows and columns;
- wherein a path of jets set up by the activated fan is from the fan to the top of the chipset via the apertures and the space.
1 more element
A cooling device for a chipset comprising:
- a fan;
- and
- a rectangular heat sink including four side legs securely snapped together with the chipset for forming a space between an underside of the heat sink and a top of the chipset, a plurality of first apertures in a central portion, and a plurality of second apertures around the first apertures, the second apertures being smaller than the first apertures and the first and the second apertures being arranged in a form of rows and columns;
- wherein a path of jets set up by the activated fan is from the fan to the top of the chipset via the first and the second apertures and the space.
1 more element
Dependencies are inferred from the claim text.