Input/output architecture for integrated circuits with efficeint positioning of integrated circuit elements
OwnerUming Koinventor
Life of this patent
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Abstract
A described embodiment of the present invention includes an integrated circuit having a plurality of I/O modules. The I/O modules include a bond pad formed on a substrate. The I/O modules also include an electrostatic discharge device formed in the substrate. The electrostatic discharge device is at least partially formed beneath the bond pad. The I/O module also includes an I/O buffer formed in the substrate. The I/O buffer is connected to the bond pad. The I/O buffer provides communication between the bond pad and circuitry formed in the substrate. The circuitry is positioned substantially adjacent to both the electrostatic discharge device and the I/O buffer.
Claims41
An integrated circuit having a plurality of I/O modules comprising:
- a bond pad formed on a substrate;
- an electrostatic discharge device formed in the substrate, the electrostatic discharge device being at least partially formed beneath the bond pad;
- an I/O buffer formed in the substrate and connected to the bond pad, the I/O buffer providing communication between the bond pad and circuitry formed in the substrate, wherein the circuitry is positioned substantially adjacent to both the electrostatic discharge device and the I/O buffer.
An integrated circuit comprising:
- a functional core formed on a substrate, the functional core being positioned centrally on the substrate;
- and
- an I/O region positioned at the periphery of the functional core, the I/O region including a plurality of I/O modules, the I/O modules including:
- a bond pad formed on a substrate;
- an electrostatic discharge device;
- and
- an I/O buffer wherein the I/O buffer is not positioned between the bond pad and the functional core.
An integrated circuit comprising:
- a functional core formed on a substrate, the functional core including a plurality of integrated circuit elements and being positioned centrally on the substrate;
- and
- an I/O region positioned at the periphery of the functional core, the I/O region including a plurality of I/O modules, the I/O modules including:
- a bond pad formed on a substrate, the bond pad including a conductive surface for providing electrical connection to external devices;
- an electrostatic discharge device formed beneath the bond pad;
- and
- a CMOS I/O buffer wherein the I/O buffer is not positioned between the bond pad and the functional core.
A method for forming an integrated circuit having a plurality of I/O modules comprising:
- forming a bond pad formed on a substrate;
- forming an electrostatic discharge device formed in the substrate, the electrostatic discharge device being at least partially formed beneath the bond pad;
- and
- forming an I/O buffer formed in the substrate and connected to the bond pad, the I/O buffer providing communication between the bond pad and circuitry formed in the substrate, wherein the circuitry is positioned substantially adjacent to both the electrostatic discharge device and the I/O buffer.
A method for forming an integrated circuit comprising:
- providing a functional core formed on a substrate, the functional core being positioned centrally on the substrate;
- and
- in an I/O region positioned at the periphery of the functional core, forming a plurality of I/O modules, the steps for forming the I/O modules including:
- forming a bond pad formed on a substrate;
- forming an electrostatic discharge device;
- and
- forming an I/O buffer wherein the I/O buffer is not positioned between the bond pad and the functional core.
Dependencies are inferred from the claim text.