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US 2004/0171195 A1Published application
Method for encapsulating a chip having a sensitive surface
AssigneeElmos Advanced Packaging B.V.
InventorJurgen Raben
Life of this patent
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AssigneeElmos Advanced Packaging B.V.
InventorJurgen Raben
Estimating the term…
Method for encapsulating a chip having a sensitive surface exposed in a sealed highly clean cavity package, includes: a) mounting the chip onto a lead frame, b) bonding the chip contact pads to the lead frame contact pads c) positioning the chip and lead frame into the one part of a two part mould d) taking measures to keep the space above the sensitive surface of the chip free during the encapsulation process, e) closing the mould by placing the second part thereof on top of the one part, f) introducing the package material into the mould and providing the circumstances to let the package cure in the desired manner, The measures in step d) comprise: applying a closed dam of heat resistant material around the sensitive chip area, placing a lid on the dam such that space above the sensitive area enclosed by the dam and lid is sealed.
Method for encapsulating a chip having a sensitive surface exposed in a sealed highly clean cavity package, comprising the following steps:
Method according to any one of the aforementioned claims, characterised in that the dimensions of the dam are selected such that the bonding wires will be encapsulated either by the package material or by the dam material.
Method according to any of the afore-mentioned claims, characterized in that the lid has an opening providing direct access to the inner cavity surrounded by the chip, the dam, and the inner lid surface.
Dependencies are inferred from the claim text.