Heat sink mounting assembly
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorsHsieh Kun Lee, WanLin Xia, Tao Li
Life of this patent
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Abstract
A heat sink mounting assembly includes a retention module (80) accommodating a heat sink (50) therein, and two retaining units (10) cooperating with the retention module to secure the heat sink therein. Each retaining unit includes a retaining clip (20) engaging with the retention module, and a pressing body (40) attached to the retaining clip. The pressing body includes a pressing portion (42) urging against the heat sink, and two releasing arms (46) each having a spring finger (48) snappingly engaging with the retaining clip when the pressing body is pressed toward the heat sink. When the releasing arms are squeezed, the spring fingers disengage from the retaining clip, and the pressing portion is released from the heat sink.
Claims17
A mounting assembly adapted for mounting a heat sink on an electronic package on a circuit board, the mounting assembly comprising:
- a retention module adapted to be mounted on the circuit board, the retention module comprising a pair of columns cooperatively defining a space therebetween adapted for accommodating the heat sink therein;
- and
- a retaining unit cooperating with the columns for securing the heat sink in said space, each of the retaining units comprising:
- a retaining clip comprising first and second legs releasably engaging with the columns respectively;
- and
- a pressing body attached to the retaining clip, the pressing body comprising a pressing portion disposed between the retaining clip and the heat sink, an operation portion disposed outside the retaining clip opposite to the pressing portion, and latching devices formed adjacent the operation portion;
- wherein
- upon pressing the operation portion toward the heat sink, the latching devices engage with the retaining clip to retain the pressing body in a locked position and to elastically deform the pressing body to thereby press the heat sink toward the electronic package.
A heat sink assembly comprising:
- a heat sink adapted to contact an electronic device for removing heat generated by the electronic device;
- a retention device adapted to be mounted on a circuit board;
- and
- a retaining unit cooperating with the retention device to sandwich the heat sink therebetween, the retaining unit comprising:
- a retaining clip comprising a main body located above the heat sink, and first and second legs releasably engaging with opposite sides of the retention device;
- and
- a pressing body comprising a pressing portion located between the retaining clip and the heat sink, for pressing the heat sink toward the electronic device when the pressing body is disposed in a locked position, and latch means for engaging with the retaining clip to maintain the pressing body in said locked position;
- wherein
- the pressing body further comprises a releasing device, and upon operating the releasing device to move to an unlocked position, the pressing body is released from said locked position.
A heat sink assembly comprising:
- a printed circuit board;
- a retention device mounted on the printed circuit board;
- a heat generating device located above the printed circuit board;
- a heat sink mounted upon the heat generating device;
- at least one retaining unit positioned upon the heat sink, said retaining unit including:
- a retaining clip moveable relative to the heat sink and defining a main body with two opposite legs to be respectively engaged with the retention device;
- and
- a pressing body attached to the retaining clip in a moveable manner;
- said pressing body defining a central pressing portion sandwiched between the retaining clip and the heat sink, and at least one upwardly extending resilient portion with a locking finger thereof;
- wherein
- when said locking finger is locked to the retaining clip, the upwardly extending resilient portion is deflected and results in a reflection force upon the retaining clip to urge the retaining clip to move upwardly whereby the whole retaining unit is in a tension manner for tightly pressing downwardly the heat ink against the heat generating device;
- oppositely when said locking finger is unlocked from the retaining clip, the upwardly extending resilient portion is relatively undeflected and exposed to an exterior above said retaining clip whereby the whole retaining unit is in a relaxed manner.
Dependencies are inferred from the claim text.