Encapsulation method and leadframe for leadless semiconductor packages
AssigneeSiliconix Taiwan Ltd.
InventorFrank Kuo
Life of this patent
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Abstract
An encapsulation technique for leadless semiconductor packages entails: (a) attaching a plurality of dice (411) to die pads in cavities (41-45, 51-55) of a leadframe, the cavities arranged in a matrix of columns and rows; (b) electrically connecting the dice to a plurality of conducting portions (412-414) of the leadframe; and (c) longitudinally injecting molding material into the cavities along the columns via a plurality of longitudinal gates (46-49, 56-59) of the leadframe to package the dice in the cavities, the longitudinal gates situated between the cavities along the columns.
Claims4
1-24. (Canceled).
An encapsulation method for leadless semiconductor packages, the method comprising:
- attaching a plurality of dice to die pads in a plurality of cavities of a lead frame, the cavities arranged in a matrix of columns and rows;
- electrically connecting the dice to a plurality of conducting portions of the leadframe;
- causing a molding material to flow into a first cavity;
- causing said molding material to flow from said first cavity into a second cavity adjacent to and in the same column as said first cavity;
- and
- causing said molding material to flow from said first cavity into a third cavity adjacent to and in the same row as said first cavity.
Dependencies are inferred from the claim text.