Apparatus and method for processing wafers

A method for processing a wafer, comprising:

• providing a flow chamber having a first gas inlet for allowing a first gas to flow in the flow chamber;
• providing a wafer inlet at which the wafer enters the flow chamber, the wafer inlet being coupled to a wafer storage device;
• providing a wafer outlet at which the wafer exits the flow chamber, the wafer outlet being adapted to be coupled to a wafer processing apparatus;
• providing a robotic apparatus in the flow chamber for moving the wafer from the wafer inlet to the wafer outlet;
• and
• allowing a second gas to enter the flow chamber such that the second gas combines with the first gas and flows into the wafer storage device, such that the amount of contaminants entering the wafer storage device is reduced.

An apparatus for manufacturing a semiconductor device, comprising:

• a wafer storage device for storing a semiconductor wafer on which the device is manufactured;
• a wafer processing apparatus for performing a manufacturing process on the wafer;
• and
• a wafer transfer apparatus for transferring the wafer between the wafer storage device and the wafer processing apparatus, the wafer transfer apparatus comprising:
• a flow chamber having a first gas inlet for allowing a first gas to flow in the flow chamber,
• a wafer inlet at which the wafer enters the flow chamber, the wafer inlet being coupled to the wafer storage device,
• a wafer outlet at which the wafer exits the flow chamber, the wafer outlet being adapted to be coupled to the wafer processing apparatus,
• a robotic apparatus in the flow chamber for moving the wafer from the wafer inlet to the wafer outlet, and
• a second gas inlet for allowing a second gas to enter the flow chamber such that the second gas combines with the first gas and flows into the wafer storage device, such that the amount of contaminants entering the wafer storage device is reduced.

A method for manufacturing a semiconductor device, comprising:

• storing a semiconductor wafer on which the device is manufactured in a wafer storage device;
• performing a manufacturing process on the wafer in a wafer processing apparatus;
• and
• transferring the wafer between the wafer storage device and the wafer processing apparatus using a wafer transfer apparatus, said transferring comprising:
• providing a flow chamber having a first gas inlet for allowing a first gas to flow in the flow chamber,
• coupling a wafer inlet at which the wafer enters the flow chamber to the wafer storage device,
• coupling a wafer outlet at which the wafer exits the flow chamber to the wafer processing apparatus,
• moving the wafer from the wafer inlet to the wafer outlet using a robotic apparatus, and
• allowing a second gas to enter the flow chamber through a second gas inlet such that the second gas combines with the first gas and flows into the wafer storage device, such that the amount of contaminants entering the wafer storage device is reduced.