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AssigneeAlcatel-Lucent USA Inc.
InventorsVictor Alexander Lifton, Victor Manuel Lubecke, Flavio Pardo
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Polyimide is used as a spacer that also bonds together the elements that it is spacing apart. This is achieved by constructing the spacer on at least one of the wafers as is conventionally done, except that prior to performing the final curing of the polyimide precursor to form the final polyimide, the elements are aligned in a bonder and placed in contact with a pressure of 40 grams per square millimeter at a temperature slightly higher than the soft-bake temperature, as specified by the manufacturer of the polyimide precursor, for few minutes to promote tackiness. This holds the elements together, and the combined structure is then baked to fully cure the polyimide precursor into polyimide and complete the bonding.
A flip-chip assembly, in which a first chip and a second chip are bonded together via a polyimide spacer.
A method for use bonding a first chip and a second chip to form a flip-chip assembly, the method comprising the step of:
A device, in which a first surface and a second surface are bonded together via a polyimide spacer.
A device, in which a first substrate and a second substrate are bonded together via a polyimide spacer.
Dependencies are inferred from the claim text.