Method and system for improving exposure uniformity in a step and repeat process
AssigneeAdvanced Micro Devices, Inc.
InventorsJan Raebiger, Heiko Wagner, Uwe Schulze, Rolf Seltmann
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Abstract
An advanced control system for a photolithography tool that receives measurement data relating to inline parameters varying with position on a substrate surface. The position sensitive measurement data is used to establish a position dependent target offset for an exposure map, thereby effectively compensating for substrate non-uniformities. Since the inline measurement data is available significantly earlier in comparison to electrical measurement data of a completed circuit element, a more accurate exposure map may be obtained taking into account the process history of the substrates.
Claims26
A method of determining at least one exposure parameter for a multi-step exposure process in a semiconductor line, the method comprising:
- obtaining information about an inline parameter indicative of a characteristic of a predefined location on a substrate;
- and
- updating said at least one exposure parameter for said predefined location on the basis of said information.
A method of forming a circuit feature on a plurality of substrates in a semiconductor production line, the method comprising:
- preparing said substrates for receiving a resist mask corresponding to said circuit feature;
- establishing an exposure map for a step and repeat exposure of said substrates;
- updating said exposure map for a plurality of specified locations on a specified one of said substrates on the basis of inline measurement data obtained from one or more of said substrates;
- exposing said specified substrate with said updated exposure map to form said resist mask;
- and
- performing a manufacturing sequence to form said circuit feature by using said resist mask.
A method of controlling a multi-step exposure of substrates during the formation of a circuit feature, the method comprising:
- obtaining pre-exposure measurement data related to a predefined location on a substrate to be exposed;
- adjusting at least one exposure parameter for said predefined location on the basis of said pre-exposure measurement data;
- and
- exposing a substrate at said predefined location with the adjusted at least one exposure parameter.
A method of controlling a multi-step exposure of substrates during the formation of a circuit feature, the method comprising:
- obtaining post-exposure measurement data related to a predefined location on a substrate to be exposed;
- adjusting at least one exposure parameter for said predefined location on the basis of said post-exposure measurement data;
- and
- exposing a substrate at said predefined location with the adjusted at least one exposure parameter.
An advanced exposure tool control system, comprising:
- a control unit operatively connectable to an exposure tool and configured to adjust at least one exposure parameter of said exposure tool, said control unit being further configured to:
- receive information about an inline parameter indicative of a characteristic of a predefined location on a substrate;
- and
- update said at least one exposure parameter for said predefined location on the basis of said information.
Dependencies are inferred from the claim text.