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US 2004/0164423 A1Published application
Microstructures comprising a dielectric layer and a thin conductive layer
AssigneeShipley Company, L.L.C.
InventorDavid W. Sherrer
Life of this patent
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Abstract
Surface micromachined structures having a relatively thick dielectric layer and a relatively thin conductive layer bonded together.
Claims20
A micromachined apparatus comprising:
- a substrate;
- and
- a released microstructure disposed on the substrate, comprising:
- a dielectric layer, and
- a conductive polysilicon layer attached to the dielectric layer, wherein the polysilicon layer has a thickness less than ⅕ the dielectric layer thickness.
2 more elements
A micromachined apparatus comprising:
- a substrate;
- and
- a released microstructure disposed on the substrate, comprising:
- a dielectric layer, and
- a conductive layer attached to the dielectric layer, wherein the conductive layer has a thickness less than ⅕ the dielectric layer thickness.
2 more elements
A micromachined apparatus comprising:
- a substrate;
- and
- a released cantilever disposed on the substrate, comprising:
- a silicon carbide dielectric layer, and
- a conductive layer attached to the dielectric layer, wherein the conductive layer has a thickness less than ⅕ the dielectric layer thickness.
2 more elements
Dependencies are inferred from the claim text.