Method and apparatus for megasonic cleaning of patterned substrates

An apparatus for cleaning a semiconductor substrate, comprising:

• a base;
• at least one sidewall extending from the base, the sidewall being substantially perpendicular to the base;
• a first megasonic transducer affixed to the base;
• and
• a second megasonic transducer affixed to the sidewall, wherein the first megasonic transducer is oriented in a substantially orthogonal manner relative to the second megasonic transducer.

A system for cleaning a semiconductor substrate, comprising:

• a tank having an inner cavity defined by a base and at least one sidewall extending therefrom, the tank configured to retain a volume of a liquid within the inner cavity;
• a substrate support configured to support and rotate a semiconductor substrate about an axis of the semiconductor substrate, the substrate support further configured to support and rotate the semiconductor substrate in the inner cavity of the tank;
• a first megasonic transducer coupled to the base, a top surface of the megasonic transducer being substantially parallel to a bottom surface of the semiconductor substrate;
• and
• a second megasonic transducer coupled to the at least one sidewall, wherein the first megasonic transducer is configured to generate acoustic energy associated with a direction substantially perpendicular to the bottom surface of the semiconductor substrate and wherein the second megasonic transducer is configured to generate acoustic energy associated with a direction substantially parallel to the bottom surface of the semiconductor substrate.

A method for electroless plating of a substrate, comprising:

• immersing a substrate into a plating solution;
• depositing a film onto a surface of the substrate;
• and
• transferring acoustic energy to the plating solution, the acoustic energy directed at the surface of the substrate to control bubble formation at the surface of the substrate.