Method of manufacturing an electronic device
AssigneeKoninklijke Philips Electronics N.V.
InventorsNicolaas Gerardus Henricus Van Melick, Theodoor Gertrudis Silvester Maria Rijks
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Abstract
The present invention provides a method of manufacturing an electronic device provided with metal regions, that are mutually separated by air spaces. In the method a first isolating layer, a seed layer and a second isolating layer are provided before applying metal regions. The seed layer and the second isolating layer are only removed after the provision of the metal regions. The method can be advantageously applied for the manufacture of a multilevel interconnect structure and for the manufacture of micro-electromechanical elements.
Claims9
A method of manufacturing an electronic device provided with metal regions, that are mutually separated by air spaces, which method comprises the steps of:
- forming a patterned first isolating layer on a substrate surface;
- depositing a metal seed layer so that it covers the first isolating layer and exposed areas of the substrate surface;
- and
- forming metal regions upon the exposed seed layer;
- characterised in that
- a second patterned isolating layer is formed on the seed layer according to a second pattern, a perpendicular projection of which on the substrate surface has an overlap with the first isolating layer;
- the metal regions are formed such that they fill the patterns defined by the first and the second isolating layers, and
- the second isolating layer and the seed layer are removed after forming of the metal regions, therewith obtaining the air spaces, the seed layer being removed in so far as it is not covered by the metal regions.
Dependencies are inferred from the claim text.