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US 2004/0106256 A1Published application
Method of manufacturing a flash memory cell
AssigneeHynix Semiconductor Inc.
InventorsCha Deok Dong, Noh Yeal Kwak
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Abstract
The present invention relates to a method of manufacturing a flash memory cell. A tunnel oxide film is formed before a trench is formed and an exposed portion is then etched by a given thickness. Therefore, a phenomenon that the corner of the trench is thinly formed by a sidewall oxidization process is prevented and an active region of a desired critical dimension can be secured.
Claims23
A method of manufacturing a flash memory cell, comprising the steps of:
- sequentially forming a tunnel oxide film, a first polysilicon layer and a pad nitride film on a semiconductor substrate;
- forming a trench at the semiconductor substrate;
- forming a trench insulating film by which the trench is buried and then performing a chemical mechanical polishing (CMP) process to isolate the trench insulating film;
- removing the pad nitride film and then performing an etch process by which given portions of the trench insulating film are protruded;
- depositing a second polysilicon layer on the entire structure and then patterning the second polysilicon layer to form a floating gate;
- and
- forming a dielectric film and a control gate on the floating gate.
4 more elements
Dependencies are inferred from the claim text.