Manufacturing method of flash memory device
AssigneeRenesas Technology Corp.
InventorNoriyuki Mitsuhira
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AssigneeRenesas Technology Corp.
InventorNoriyuki Mitsuhira
Estimating the term…
A rewriting endurance of a flash memory is made to improve. A first interlayer insulating film (10) is formed on a flash memory cell which is formed in a memory element region on a semiconductor substrate (100). At this time, a furnace anneal is added as a heat treatment after a NSG layer (16) which is a top layer of the first interlayer insulating film (10) is formed, instead of a heat treatment in a short time by means of a lamp anneal. According to it, a stress which is impressed on the flash memory cell is relaxed, and a rewriting endurance is improved. Moreover, the furnace anneal is added after a first and a second aluminum wirings (21 and 31) are formed. Furthermore, when a second and a third interlayer insulating films (20 and 30) are formed, a deposition temperature of plasma TEOS layers (23 and 33) is set to be identical with a temperature of HDP layers (22 and 32) at that time. According to it, in the same manner, the rewriting endurance of the flash memory cell is improved.
A manufacturing method of a flash memory device, comprising the steps of:
A manufacturing method of a flash memory device, comprising the steps of:
A manufacturing method of a flash memory device, comprising the steps of:
A manufacturing method of a flash memory device, comprising the steps of:
Dependencies are inferred from the claim text.