Photoirradiation thermal processing apparatus and thermal processing susceptor employed therefor
AssigneeDainippon Screen Mfg. Co., Ltd.
InventorsTatsufumi Kusuda, Akihiro Hosokawa, Hiromi Murayama
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AssigneeDainippon Screen Mfg. Co., Ltd.
InventorsTatsufumi Kusuda, Akihiro Hosokawa, Hiromi Murayama
Estimating the term…
A susceptor is formed with a cavity having a tapered surface and a receiving surface. The gradient α of the tapered surface with respect to the receiving surface is set to at least 5° and less than 30°, so that a semiconductor wafer received by the susceptor can be located on the receiving surface through the tapered surface while the semiconductor wafer can be protected against excess stress also when the surface of the wafer abruptly thermally expands due to flashlight irradiation and can be prevented from cracking in thermal processing. Thus provided are a thermal processing susceptor and a thermal processing apparatus capable of preventing a substrate from cracking in thermal processing.
A thermal processing susceptor holding a substrate subjected to thermal processing, comprising:
A thermal processing susceptor holding a substrate subjected to thermal processing, comprising a cavity storing said substrate in thermal processing, wherein
A thermal processing apparatus irradiating a substrate with light thereby heating said substrate, comprising:
A thermal processing susceptor holding a substrate subjected to thermal processing, comprising:
A thermal processing apparatus irradiating a substrate with light thereby heating said substrate, comprising:
A thermal processing susceptor receiving a substrate subjected to thermal processing, comprising:
A thermal processing susceptor receiving a substrate subjected to thermal processing, comprising:
Dependencies are inferred from the claim text.