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US 2004/0105237 A1Published application
CVD diamond enhanced microprocessor cooling system
AssigneeMorgan Advanced Ceramics, Inc.
InventorsDavid S. Hoover, Ronald R. Petkie
Life of this patent
Estimating the term…
Abstract
Cooling systems for microprocessors are addressed. Some systems may include a chemical vapor deposited (CVD) diamond heatspreader mounted to a base of a heat sink and to a microprocessor chip, while others may include a copper insert mounted within a depression of a heat sink, with the CVD diamond heatspreader mounted within an indent of the insert.
Claims10
A microprocessor cooling system, which comprises:
- a. a heat sink body for mounting to a microprocessor circuit board including a plurality of cooling fins having outer ends and inner ends and a base, having an outer surface;
- b. at least one cooling fan mounted on said outer ends of said cooling fins for directing a cooling gas through the fins;
- and
- c. a chemical vapor deposited diamond heatspreader having an inner surface mounted to the outer surface of said base and an outer surface positioned for mounting directly onto a microprocessor chip of said microprocessor circuit board.
1 more element
A microprocessor cooling system, which comprises:
- a. a heat sink body for mounting to a microprocessor circuit board including a plurality of cooling fins having out ends and inner ends, a heat sink base having two ends, an inner surface attached to said inner ends and an outer surface having a depression equidistant from each of the ends;
- b. at least one cooling fan mounted on said outer ends of said cooling fins for directing a cooling gas through the fins;
- and
- c. a copper insert having an indent equidistant from each of the ends of said heat sink body and mounted within said depression and a chemical vapor deposited diamond heatspreader insert having an inner surface mounted within said indent and an outer surface positioned for mounting directly onto a main microprocessor chip of said microprocessor circuit board.
1 more element
Dependencies are inferred from the claim text.