Heat sink assembly with retention module and clip

An electronic device comprising:

• a printed circuit board having an electronic package mounted thereon;
• a retention module surrounding the electronic package, the retention module being integrally formed, two pins extending from the retention module to the printed circuit board and being welded to the printed circuit board;
• a heat sink;
• and
• a clip cooperating with the retention module to press the heat sink against the electronic package.

A heat sink assembly comprising:

• a printed circuit board with an electronic package located thereon and a plurality of through holes therein;
• a retention module surrounding the electronic package with four projections diagonally extending outwardly from four corners thereof, respectively;
• four pins respectively extending through said four projections of the retention module and fastened to the corresponding through holes;
• a heat sink defining a plurality of slots;
• a clip defining a rectangular frame like configuration with at least two pressing bars extending through the corresponding slots in a parallel relationship;
• and
• two pairs of locking devices located at two opposite sides of the clip, which are perpendicular to the pressing bars, and respectively latchably engaged with two opposite sides of the retention module, each of which is vertically aligned with the corresponding side of the clip and located between a corresponding pair of said four projections.