Device for fixing thin and flexible substrates
AssigneeSuss Microtec Lithography GmbH
InventorsWalter Demel, Ralph Zoberbier
Life of this patent
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Abstract
A device or chuck for fixing thin and/or flexible substrates allows a uniform and all-over sucking-up of the substrates without any disadvantageous warping or bending. The chuck has notches and holes communicating with a plurality of microgrooves arranged on the bearing surface. If a vacuum device sucks off air through the bores and the notches, a vacuum extends in the microgrooves so that a substrate located on the bearing surface is sucked up.
Claims11
A device for fixing a thin and/or flexible substrate, comprising a holding device for placing and holding a substrate on its bearing surface in which notches and/or holes, which communicate with each other and with a vacuum device, are formed, wherein
- a plurality of microgrooves, which communicate with the notches and/or holes, are provided in the bearing surface.
Dependencies are inferred from the claim text.