Encapsulated surface acoustic wave component and method of collective fabrication
AssigneeThomson-CSF
InventorsAgnes Bidard, Jean-Marc Bureau
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Abstract
The invention relates to a new type of encapsulated surface acoustic wave component and to a method for the batch production of such components. The component comprises a surface acoustic wave device on the surface of a substrate. The encapsulation package furthermore comprises the substrate, a first layer located on the substrate and hollowed out locally at least at the level of the active surface of the surface acoustic wave device, a printed circuit covering entire first layer and conductive via holes going through the unit formed by the first layer and the printed circuit so as to provide for the electrical connection of the surface acoustic wave device from the exterior.
Claims14
A surface acoustic wave component comprising at least one surface acoustic wave device encapsulated in a package, said device being made on the surface of a piezoelectric substrate by means of interdigitated electrodes powered by first conductive contacts internal to the surface of the substrate, characterized in that the package comprises, in addition to the substrate:
- a first layer located on the substrate and hollowed out locally at least at the level of the active surface of the surface acoustic wave device;
- a printed circuit covering the entire first layer, said printed circuit comprising second external conductive contacts;
- conductive via holes going through the unit formed by the first layer/printed circuit and connecting the first internal conductive contacts to the second external conductive contacts.
Dependencies are inferred from the claim text.