Method and apparatus for cooling a reticle during lithographic exposure

A method of dissipating heat from a substrate comprising the steps of:

• transferring heat from the substrate to a substrate receiving device;
• transferring the heat from the substrate receiving device to a uniform heat removing device;
• transferring the heat from the uniform heating removing device to a first radiative coupler;
• radiatively transferring the heat from the first radiative coupler to a second radiative coupler;
• and
• removing said radiatively transferred heat with a cooling system.

A system comprising:

• a first stage including a radiative coupler and cooling portion;
• and
• a second stage that is radiatively coupled to said first stage, said second stage including:
• a substrate receiving device,
• a uniform heat removing portion coupled to the substrate receiving device, and
• a radiative coupler coupled to the uniform heat removing portion.

A system for receiving, holding, and controlling a temperature of a substrate, the system comprising:

• a rigid structure having substantially zero coefficient of thermal expansion (CTE) that constrains the substrate;
• a heat removal portion having a larger CTE and thermal conductivity than said rigid structure that removes excess heat from the substrate;
• means for thermally coupling the substrate to said heat removal portion;
• means for thermally isolating said heat removal portion from said rigid structure;
• means for mechanically coupling said heat removal portion to said rigid structure;
• and
• radiative means for removing excess heat from said heat removal portion.