Infrared detector packaged with improved antireflection element
AssigneeHoneywell International Inc.
InventorBarrett E. Cole
Life of this patent
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Abstract
An infrared detector has a window in a cover having a cavity for exposing detector pixels to incident radiation. The window has an antireflective element formed within the cavity as a field of posts. The field of post structures is formed in a cavity by etching the posts in a desired pattern first, and forming the cavity by a general etch over the whole field afterward.
Claims50
A package cover having a cavity for receiving an infrared detector and a window area for transmitting infrared radiation to the detector, an interior surface of the window area within the cavity having a field of posts shaped and spaced so as to form an antireflection element for infrared radiation transmitted through the window area.
An infrared detector, comprising:
- an array of pixels for producing an electrical signal in response to incident infrared radiation;
- a substrate for holding the array;
- a package cover having a window in a cavity for transmitting the radiation to the array;
- a field of spaced posts for reducing reflections of the infrared radiation in the window.
A method for fabricating an infrared optical element from a wafer of material capable of transmitting infrared radiation therethrough, comprising, in the order listed:
- masking a surface of the wafer with a pattern defining a cross section of a field of posts;
- etching the wafer surface so as to form the field of posts to a desired depth;
- masking the field of posts with a shape defining a cavity in the surface of the wafer;
- etching the wafer surface including the field of posts so as to form a cavity in the wafer.
A method for fabricating an infrared optical device, comprising:
- masking a surface of a wafer of material capable of transmitting infrared radiation therethrough with a pattern defining a field of posts;
- etching the wafer surface so as to form the field of posts to a desired height;
- applying an antireflection element to the other surace of the wafer;
- sealing the wafer to a substrate containing an array of bolometers.
Dependencies are inferred from the claim text.