Transfer holding of integrated circuit packages

Apparatus for encapsulating and underfilling an integrated circuit chip assembly including an integrated circuit chip mounted on a substrate in a standoff relationship, said apparatus comprising:

• a mold having a first portion and a second portion;
• said first portion having first and second cavities and at least one channel interconnecting said first and second cavities;
• said first cavity being adapted to enclose said integrated circuit chip on said substrate;
• a vent for exhausting air from said first cavity;
• and
• injecting structure for injecting encapsulant into said first cavity of said first portion at two spaced locations in said first portion remote from the point of connection of said at least one channel to said first cavity generally in the direction toward said at least one channel, such that encapsulant flows around and underneath the integrated circuit chip and through at least one channel into said second cavity to thereby underfill and encapsulate said integrated circuit assembly.

An integrated circuit package comprising.

• an integrated circuit chip mounted on a top surface of a substrate in a standoff relationship;
• an encapsulant body adhering to the top surface of the substrate, encapsulating the chip and filling the standoff space between the chip and substrate;
• and
• at least one elongated encapsulant channel adhering to the top surface of the substrate and extending outwardly from the encapsulated chip.