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US 2004/0070945 A1Published application
Heat dissipation structures and method of making
OwnerWayne Rowlandinventor
Life of this patent
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Abstract
A method and related structure for dissipating heat, particularly in electronic components. The method includes mixing magnetite particles and epoxy into a paste-like state, subjecting the mixture to opposing polarities of a magnetic field on opposing sides of the mixture until the epoxy hardens to urge the magnetite particles into alignment and to form elongate structures to conduct heat away from a heat source, such as an electronic component on which the epoxy is applied.
Claims10
A method of providing a heat dissipating structure, comprising:
- forming a mixture of magnetite particles and epoxy;
- and
- subjecting the mixture to a magnetic field to cause the magnetite particles to connect and align into elongate heat conductive structures.
A method of forming a heat dissipating coil, comprising:
- forming a mixture of magnetite particles and epoxy;
- applying the mixture to an electronic component;
- subjecting the mixture of the magnetite particles and the epoxy to a magnetic field before the epoxy dries to form elongate heat conducting structures of the magnetite particles;
- and
- maintaining the magnetic field until the epoxy hardens.
2 more elements
An electronic device, comprising:
- an electronic component;
- and
- an epoxy compound form of an epoxy and magnetite particles applied to the electronic component, the magnetite particles formed into heat conducting structures in the epoxy to conduct heat generated by the electronic component.
Dependencies are inferred from the claim text.