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US 2004/0070914 A1Published application
Electrostatic device for holding an electronic component wafer
AssigneeSemco Engineering SA
InventorDavid Ferreres
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AssigneeSemco Engineering SA
InventorDavid Ferreres
Estimating the term…
A device for holding a wafer, an electronic component comprises a system for transporting without deformation a wafer of electronic components. The device also enables the transport by one or the other of the passive or active faces. The device comprises a planar and thin rigid support having a controllable temperature and at least an electrode consisting of (N+1) elements, confined between two sheets of insulating material. The support provides a protrusion-free surface for gripping the wafer, and electrostatic elements for positive retention of the wafer induces a gripping power of the latter distributed over the entire support. The U-shaped support is borne by the electrical bond of the electrode with a remote (adjustable, AC or DC, mono-multipolar) power source. The gripping surface of the device is planar and protrusion-free whatever the geometry of the support used.
Device for holding a wafer (2) of an electronic component or the like, of the type comprising a holding member for the wafer (2), provided with positive holding means for this latter pressed against an overall flat surface of the holding member, characterized:
Device according to any one of the preceding claims, characterized in that the support (4) is of stainless steel.
Device according to any one of the preceding claims, characterized in that the electrode (8) is confined between two sheets (6, 10) of an insulating material.
Device according to any one of the preceding claims, characterized:
Device according to any one of the preceding claims, characterized:
Device according to any one of the preceding claims, characterized:
Dependencies are inferred from the claim text.