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US 2004/0070413 A1Published application
Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method
AssigneeRenesas Technology Corp.
InventorsSusumu Kasukabe, Takehiko Hasebe, Yasunori Narizuka, Akio Hasebe
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Abstract
A probe card has first contact terminals electrically connected to the fine-pitch electrodes of a test target; wirings drawn from the first contact terminals; and second contact terminals electrically connected to the wirings, wherein the first contact terminals are formed each using an anisotropically etched hole in a crystalline substrate, and a semiconductor device test method (fabrication method) using the probe card.
Claims20
A probe sheet comprising:
- contact terminals that get into contact with electrodes provided on a wafer;
- wirings drawn from said contact terminals;
- and electrode pads electrically connected to said wirings,
- wherein a pitch of said electrode pads is wider than a pitch of said contact terminals.
1 more element
A probe card comprising:
- a probe sheet having contact terminals that get into contact with electrodes provided on a wafer;
- and a multi-layer wiring substrate on which electrodes, which are electrically connected to said contact terminals, are provided on a surface opposed to the wafer, and
- wherein a pitch of said electrodes provided on the surface of said multi-layer wiring substrate opposed to the wafer is wider than a pitch of said contact terminals.
Semiconductor test equipment comprising:
- a stage on which a wafer is mounted;
- and
- a probe card having contact terminals that get in contact with electrodes of semiconductor devices formed on the wafer and electrically connected to a tester that tests electrical characteristics of the semiconductor devices
- wherein said probe card comprises a probe sheet having the contact terminals;
- and a multi-layer wiring substrate whose electrodes electrically connected to the contact terminals are provided on a surface opposed to the wafer and
- wherein a pitch of the electrodes of said multi-layer wiring substrate provided on the surface opposed to the wafer is wider than a pitch of said contact terminals.
3 more elements
Dependencies are inferred from the claim text.