Method for manufacturing an interconnected circuit board assembly and system

A method for manufacturing an interconnected circuit board assembly, the method comprising:

• placing one or more spacers on one or more first bond pads of a first circuit board, wherein the first circuit board includes a glass substrate, multiple optoelectrical display elements located on the glass substrate, and the one or more first bond pads;
• aligning the first circuit board with a second circuit board, so that one or more second bond pads of the second circuit board make electrical contact with the one or more spacers, and the one or more spacers are located in an interface region between the first circuit board and the second circuit board;
• attaching the first circuit board to the second circuit board, wherein the one or more spacers are formed of a conductive material that remains in a solid form while attaching the first circuit board to the second circuit board;
• and
• depositing an insulating material in the interface region, wherein the insulating material contacts both the first circuit board and the second circuit board.

A method for manufacturing an electronic system with a processor, which functions as an image generator, the method comprising:

• manufacturing an interconnected circuit board assembly by
• placing one or more spacers on one or more first bond pads of a first circuit board, wherein the first circuit board includes a glass substrate, multiple optoelectrical display elements located on the glass substrate, and the one or more first bond pads,
• aligning the first circuit board with a second circuit board, so that one or more second bond pads of the second circuit board make electrical contact with the one or more spacers, and the one or more spacers are located in an interface region between the first circuit board and the second circuit board,
• attaching the first circuit board to the second circuit board, wherein the one or more spacers are formed of a conductive material that remains in a solid form while attaching the first circuit board to the second circuit board, and
• depositing an insulating material in the interface region, wherein the insulating material contacts both the first circuit board and the second circuit board;
• and
• coupling an interconnected circuit board assembly to the processor.