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US 2004/0070052 A1Published application
Integrated circuit configuration comprising a sheet-like substrate
AssigneeInfineon Technologies AG
InventorsMarcus Janke, Peter Laackmann
Life of this patent
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Abstract
An integrated circuit is formed on a non-planar substrate. The integrated circuit is formed over a plurality of layers. Chemical or physical changes in the microstructure of the substrate cause the bending of the substrate, in one or more propagation directions.
Claims8
An integrated circuit configuration, comprising:
- a sheet-like substrate having at least one non-planar surface in at least one propagation direction;
- an integrated circuit formed on said substrate in a plurality of layers at least on one side of said substrate;
- said substrate having a structure with chemical or physical changes causing mechanical stresses imparting a curvature defining the non-planar surface of said substrate.
Dependencies are inferred from the claim text.