Led packages having improved light extraction

A light-emitting diode package comprising:

• a substantially transparent dielectric substrate having a top surface, a bottom surface and at least one sidewall extending between the top and bottom surfaces;
• a light-emitting diode overlying said substantially transparent dielectric substrate, said light-emitting diode including a first region of a first conductivity type, a second region of a second conductivity type and a light-emitting p-n junction between said regions, wherein the at least one sidewall of said substantially transparent dielectric substrate has a roughened surface.

A light-emitting microelectronic package comprising:

• a substantially transparent dielectric substrate having a top surface, a bottom surface and at least one sidewall extending between the top and bottom surfaces;
• a light-emitting diode overlying said substantially transparent dielectric substrate, said light-emitting diode including a first region of a first conductivity type, a second region of a second conductivity type and a light-emitting p-n junction between said regions that emits light having a wavelength, wherein the at least one sidewall of said substantially transparent dielectric substrate includes a roughened surface having a pattern that is matched to the wavelength of the light emitting by the light-emitting p-n junction for optimizing the amount of light emitted from said package.

A method of making a light-emitting microelectronic package comprising:

• providing a substantially transparent dielectric substrate having a top surface and a bottom surface;
• securing one or more light-emitting diodes over the top surface of said substantially transparent dielectric substrate;
• after securing the one or more light-emitting diodes, separating said substantially transparent dielectric substrate to provide individual light-emitting packages having a height, each said individual package including at least one of the light-emitting diodes secured over a separated portion of said substantially transparent dielectric substrate, wherein each of the separated portions of said substrate has a width, the width of said substrate being no greater than twice a height of said package.

The method as claimed in 21, wherein the roughening step includes separating said substrate using a saw or using laser ablation.

A method of making a light-emitting microelectronic package comprising:

• forming a light-emitting diode including a first region of a first conductivity type, a second region of a second conductivity type, and a light-emitting p-n junction between said first and second regions, said light-emitting diode defining a lower contact surface and a mesa projecting upwardly from said lower contact surface, said first region of a first conductivity type being disposed in said mesa and defining a top surface of said mesa, said second region of a second conductivity type defining said lower contact surface, said lower contact surface substantially surrounding said mesa, wherein said mesa includes at least one sidewall extending between the top surface of said mesa and the lower contact region;
• roughening said at least one sidewall of said mesa for improving light extraction from said package.