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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShyue Sheng, Chih-Ming Ke, Hua Tai
Estimating the term…
A method for determining a surface charge state of a semiconductor wafer process surface including providing a semiconductor wafer having a process surface including patterned semiconductor features; positioning the semiconductor wafer in a scanning electron microscope (SEM) for imaging at least a portion of the process surface; adjusting an electron beam condition to produce an image of the at least a portion of the process surface including an electron beam Voltage; and, determining a Voltage present in the at least a portion of the process surface to determine a surface charge state of the process surface.
A method for determining a surface charge state of a semiconductor wafer process surface comprising the steps of:
The method of 1, wherein the step of determining a Voltage is performed in-situ with respect to a process for performing dimensional measurements of the patterned semiconductor features.
A method for determining a surface charge of a semiconductor wafer process surface comprising an exposed photoresist layer comprising the steps of:
The method of 12, wherein the step of determining a surface charge state is performed in-situ with respect to a parallel process for performing dimensional measurements of the patterned photoresist layer.
Dependencies are inferred from the claim text.