Method and apparatus for detecting backside contamination during fabrication of a semiconductor wafer
AssigneeLSI Logic Corporation
InventorsMichael J. Berman, George E. Bailey, Rennie G. Barber
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Abstract
A method of detecting contamination on a backside of a semiconductor wafer includes the steps of positioning the backside of the wafer in contact with a detection surface of a contaminant sensor, and detecting deformation of the detection surface of the contaminant sensor. The contaminant sensor may be incorporated into a fabrication device such as a wafer handling device, or can be utilized in the construction of a stand-alone device. An apparatus for detecting contamination on the backside of a semiconductor wafer is also disclosed.
Claims7
An apparatus for fabricating a semiconductor wafer, comprising:
- a wafer handling device, and
- a contaminant sensor secured to the wafer handling device, the contaminant sensor being configured to detect presence of a contaminant on a backside of the wafer when the wafer is positioned in the wafer handling device.
Dependencies are inferred from the claim text.