Water-soluble flux composition and process for producing soldered part

Abstract

There are disclosed a water-soluble flux composition which comprises a water-soluble binder and an activating agent comprising at least one compound selected from the group consisting of a sulfonic acid compound, a sulfuric acid compound, a sulfamic acid compound, a multi-valent carboxylic acid compound and a persulfuric acid compound, and a process for producing an IC part or an electronic part which comprises the steps of coating the water-soluble flux composition on a terminal of the IC part or the electronic part and subsequently soldering the terminal.

Dependencies are inferred from the claim text.